US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Semiconductor structure and forming method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,564, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and forming method thereof" was invented by Hsueh-Han Lu (Tainan, Taiwan), Kun-Ei Chen (Tainan County, Taiwan), Chen-Chieh Chiang (Kaohsiung, Taiwan) and Ling-Sung Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method are provided. The method includes patterning a substrate to form a first fin structure in a first region and a second fin structure in a second region, wherein a first width of the first fin structure is greater than a second width of the second fin stru...