US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,091, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape" was invented by Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a die, a first conductive pattern, a second conductive pattern and first and second under-ball metallurgy (UBM) patterns. The first conductiv...