US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Semiconductor device with fin structures" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,605, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD (Hsinchu, Taiwan).

"Semiconductor device with fin structures" was invented by Kun-Yu Lee (Tainan, Taiwan), Chunyao Wang (Zhubei, Taiwan) and Chi On Chui (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure and a second fin structure over a semiconductor substrate and a first epitaxial structure over the first fin structure. The semiconductor device structure also includes a second epitaxial structure over the second fin structure. The semicond...