US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Semiconductor device structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,616, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, China).

"Semiconductor device structure and methods of forming the same" was invented by Shih-Cheng Chen (New Taipei, Taiwan), Zhi-Chang Lin (Hsinchu, Taiwan), Jung-Hung Chang (Changhua, Taiwan), Lo Heng Chang (Hsinchu, Taiwan), Chih-Hao Wang (Hsinchu, Taiwan), Chien Ning Yao (Hsinchu, Taiwan) and Kuo-Cheng Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure, along with methods of forming such, are described. The structure includes a stack of semiconductor layers spaced apart from and aligned with each...