US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Semiconductor device and method of failure analysis for semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,321, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and method of failure analysis for semiconductor device" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Wei-Cheng Lin (Hsinchu, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device. The semiconductor device includes: a first cell, a dielectric layer, and a snorkel structure. The first cell has an output terminal. The dielectric layer is disposed on the first cell. The snorkel structure is disposed in the dielectric layer. The s...