US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,081, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Chung-Jung Wu (Hsinchu, Taiwan), Chih-Hang Tung (Hsinchu, Taiwan), Tung-Liang Shao (Hsinchu, Taiwan), Sheng-Tsung Hsiao (Taoyuan, Taiwan) and Jen-Yu Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. ...