US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Semiconductor arrangement and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,647, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Semiconductor arrangement and method of making" was invented by Feng-Chien Hsieh (Pingtung, Taiwan), Yun-Wei Cheng (Taipei, Taiwan) and Kuo-Cheng Lee (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor arrangement is provided. The semiconductor arrangement includes a first photodiode in a substrate. The semiconductor arrangement includes a lens array over the substrate. A first plurality of lenses of the lens array overlies the first photodiode. Radiation incident upon the first plurality of lenses is directed by th...