US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,079, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chun-Hui Yu (Hsinchu County, Taiwan), Jeng-Nan Hung (Taichung, Taiwan) and Kuo-Chung Yee (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a wafer-form semiconductor package and a thermal dissipating system. The wafer-form semiconductor package includes semiconductor dies electrically connected with each other. The thermal dissipating system is located on and thermally coupled to the wafer-form semiconductor...