ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,106, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Chun-Wen Lin (Changhua County, Taiwan), Chung-Hao Tsai (Changhua County, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan) and Che-Wei Hsu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and...