US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Methods of manufacturing semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,104, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of manufacturing semiconductor devices" was invented by Yu-Hung Lin (Taichung, Taiwan), An-Jhih Su (Taoyuan, Taiwan), Der-Chyang Yeh (Hsin-Chu, Taiwan), Shih-Guo Shen (New Taipei, Taiwan), Chia-Nan Yuan (Hsinchu, Taiwan) and Ming-Shih Yeh (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes the following steps. A semiconductor substrate is provided. A plurality of dielectric layers and a plurality of first conductive features in the dielectric layers are formed on ...