US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Method of fabricating a semiconductor structure and semiconductor structure obtained therefrom" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,056, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of fabricating a semiconductor structure and semiconductor structure obtained therefrom" was invented by Kenichi Sano (Hsinchu, Taiwan), Chung-Liang Cheng (Changhua County, Taiwan), De-Yang Chiou (Hsinchu, Taiwan), Kuanliang Liu (Pingtung County, Taiwan) and Pinyen Lin (Rochester, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor structure and the semiconductor structure are disclosed. The method uses high flow rate of an etchant and an optimized scan pattern, so that the obtained semiconductor ...