US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Method for depositing target material in deposition chamber with tiltable workpiece holder" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,042, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for depositing target material in deposition chamber with tiltable workpiece holder" was invented by Hsuan-Chih Chu (Hsinchu, Taiwan), Wen-Hao Cheng (Taichung, Taiwan), Yen-Yu Chen (Taichung, Taiwan) and Yi-Ming Dai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes supporting a workpiece on a workpiece holder within a material deposition chamber. The method includes rotating the workpiece holder, tilting the workpiece holder in response to an output of a determination circuit, and controlling a temperature of...