US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 24 for "Method and structure for barrier-less plug" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,013, issued on June 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method and structure for barrier-less plug" was invented by Sung-Li Wang (Hsinchu County, Taiwan), Hung-Yi Huang (Hsin-chu, Taiwan), Yu-Yun Peng (Hsinchu, Taiwan), Mrunal A. Khaderbad (Hsinchu, Taiwan), Chia-Hung Chu (Taipei, Taiwan), Shuen-Shin Liang (Hsinchu County, Taiwan) and Keng-Chu Lin (Ping-Tung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes receiving a structure having a dielectric layer over a conductive feature, wherein the conductive feature includes a second metal. The method further includes etching a hole t...