US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Metal patterning for internal cell routing" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,098, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Metal patterning for internal cell routing" was invented by Shih-Wei Peng (Hsinchu, Taiwan), Chih-Liang Chen (Hsinchu, Taiwan), Charles Chew-Yuen Young (Cupertino, Calif.), Hui-Ting Yang (Hsinchu, Taiwan), Jiann-Tyng Tzeng (Hsinchu, Taiwan) and Wei-Cheng Lin (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device or structure includes a first pattern metal layer disposed between a first supply metal tract and a second supply metal tract, the first pattern metal layer comprising an internal route and a power route. A...