US Patent Issued to Taiwan Semiconductor Manufacturing on June 24 for "Manufacturing method of semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,072, issued on June 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Manufacturing method of semiconductor package" was invented by Shih-Hao Tseng (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan) and Ming-Che Ho (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor package includes the following steps. An integrated circuit structure is provided, wherein the integrated circuit structure includes an integrated circuit and a metallization layer covering a back surface of the integrated circuit. An encapsulation material is provided to laterally encapsulate the integ...