US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 17 for "Semiconductor structures with a hybrid substrate" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,246, issued on June 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structures with a hybrid substrate" was invented by Ming-Shuan Li (Hsinchu County, Taiwan), Chih Chieh Yeh (Taipei, Taiwan) and Shih-Hao Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes N-type MBC transistors formed over a first region of a hybrid substrate and P-type MBC transistors formed over a second region of the hybrid substrate. The first region and the second region have top surfaces with different crystal orientations. Particularly, the first region for forming the N-...