US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Semiconductor package including package substrate with dummy via and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,451, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including package substrate with dummy via and method of forming the same" was invented by Chin-Hua Wang (New Taipei, Taiwan), Po-Chen Lai (Hsinchu, Taiwan), Chun-Wei Chen (Taoyuan, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a package substrate including a dummy via on a first side of the package substrate, an interposer module on a second side of the package substrate opposite the first side of the package substrate, and a stiffener ri...