US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Semiconductor package and method of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,465, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of forming same" was invented by Li-Hsien Huang (Zhubei, Taiwan), Yao-Chun Chuang (Hsinchu, Taiwan), SyuFong Li (Taoyuan, Taiwan), Ching-Pin Lin (Hsinchu, Taiwan) and Jun He (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method includes attaching a first package component to a first carrier, the first package component comprising: an aluminum pad disposed adjacent to a substrate; a sacrificial pad disposed adjacent to the substrate, the sacrificial pad comprising a major surface ...