US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 17 for "Photonic device and methods of forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,478, issued on June 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photonic device and methods of forming same" was invented by Yuan-Sheng Huang (Taichung, Taiwan) and Wei-Kang Liu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photonic device and related method for forming a photonic device. In some embodiments, a method of fabricating a photonic device includes forming a layer stack over a substrate. In some cases, the layer stack includes a lower cladding layer, a core layer disposed over the lower cladding layer, and an upper cladding layer disposed over the core layer. In some example...