US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Package with tilted interface between device die and encapsulating material" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,406, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Package with tilted interface between device die and encapsulating material" was invented by Ming-Yen Chiu (Zhubei, Taiwan), Hsin-Chieh Huang (Hsinchu, Taiwan) and Ching Fu Chang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a polymer layer covering a metal via in a wafer, grooving the wafer to form a trench, wherein the trench extends from a top surface of the polymer layer into the wafer, and performing a die-saw on the wafer to separate the wafer into a plurality of device dies. A kerf passes through ...