US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Package structure including photonic package having embedded optical glue" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,362, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including photonic package having embedded optical glue" was invented by Jiun Yi Wu (Zhongli, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package includes: bonding a first wafer to a second wafer, where the first wafer includes a plurality of electronic dies, and the second wafer includes a plurality of photonic dies; after bonding the first wafer, forming trenches in the second wafer between adjacent ones of the plurality of photonic dies; filling th...