US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Package structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,434, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of forming the same" was invented by Chih-Hsuan Tai (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Tsung-Hsien Chiang (Hsinchu, Taiwan), Yu-Chih Huang (Hsinchu, Taiwan), Chia-Hung Liu (Hsinchu, Taiwan), Ban-Li Wu (Hsinchu, Taiwan), Ying-Cheng Tseng (Tainan, Taiwan) and Po-Chun Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution lay...