US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Middle-of-line interconnect structure and manufacturing method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,435, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Middle-of-line interconnect structure and manufacturing method" was invented by Cheng-Wei Chang (Taipei, Taiwan), Sung-Li Wang (Zhubei, Taiwan), Yi-Ying Liu (Hsinchu, Taiwan), Chia-Hung Chu (Taipei, Taiwan) and Fang-Wei Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to an integrated circuit device. A transistor structure includes a gate electrode separated from a substrate by a gate dielectric and a pair of source/drain regions disposed within the substrate on opposite sides ...