US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 17 for "Method for forming a semiconductor die and a photoelectric device integrated in a same package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,487, issued on June 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for forming a semiconductor die and a photoelectric device integrated in a same package" was invented by Jen-Yuan Chang (Hsinchu, Taiwan) and Chia-Ping Lai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure includes receiving a die; forming a dielectric layer to surround the die; removing a portion of the dielectric layer to form a first recess; disposing a first light blocking layer within the first recess; applying a dielectric paste over the first light blocking layer; remov...