ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,457, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Integrated fan-out package" was invented by Chuei-Tang Wang (Taichung, Taiwan), Tzu-Chun Tang (Kaohsiung, Taiwan), Chieh-Yen Chen (Taipei, Taiwan) and Che-Wei Hsu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated fan-out (InFO) package includes a die, an encapsulant, and a horn antenna. The die has an active surface and a rear surface opposite to the active surface. The encapsulant laterally encapsulates the die. The horn antenna is electrically connected to the die. The horn antenna includes a top wall and a bottom w...