US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Forming recesses in molding compound of wafer to reduce stress" (Taiwanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,474, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Forming recesses in molding compound of wafer to reduce stress" was invented by Chun-Hung Lin (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip includes a semiconductor substrate, an electrical connector over the semiconductor substrate, and a molding compound molding a lower part of the electrical connector therein. A top surface of the molding compound is lower than a top end of the electrical connector. A recess extends from the top surface of the molding compound into the molding compound."

The patent was filed on April 1...