US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Exhaust piping for a semiconductor processing tool" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,365, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Exhaust piping for a semiconductor processing tool" was invented by Kuo-Sheng Lien (Hsinchu, Taiwan) and Yung-Ho Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor processing tool may include a processing tank. The semiconductor processing tool may include an arm arranged to hold a plurality of wafers over the processing tank such that wafers in the plurality of wafers are horizontally stacked over the processing tank. The semiconductor processing tool may include a fan arranged over the arm to permit an airflow t...