US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Encapsulated package including device dies connected via interconnect die" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,464, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Encapsulated package including device dies connected via interconnect die" was invented by Kuo-Chiang Ting (Hsinchu, Taiwan), Chi-Hsi Wu (Hsinchu, Taiwan), Shang-Yun Hou (Jubei, Taiwan), Tu-Hao Yu (Hsinchu, Taiwan), Chia-Hao Hsu (Hsinchu, Taiwan) and Ting-Yu Yeh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the se...