US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Deposition system and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,392, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Deposition system and method" was invented by Wen-Hao Cheng (Hsinchu, Taiwan), Hsuan-Chih Chu (Hsinchu, Taiwan) and Yen-Yu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a subs...