ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,475, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"3D trench capacitor for integrated passive devices" was invented by Xin-Hua Huang (Xihu Township, Taiwan), Chung-Yi Yu (Hsin-Chu, Taiwan), Yeong-Jyh Lin (Caotun Township, Taiwan) and Rei-Lin Chu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second subs...