US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Systems for semiconductor package mounting with improved co-planarity" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,782, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Systems for semiconductor package mounting with improved co-planarity" was invented by Wen-Yi Lin (New Taipei, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan), Chien-Chen Li (Hsinchu, Taiwan) and Chen-Shien Chen (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate for a semiconductor package includes an array of bonding pads on a first surface of the substrate, and a plurality of raised structures adjacent to at least some of the bonding pads on the first surface of the substrate. The raised structures may be configured to contr...