US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Semiconductor structure and manufacturing methods thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,792, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing methods thereof" was invented by Bo-Jiun Lin (Hsinchu County, Taiwan) and Tung-Ying Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate and an interconnect. The substrate has a semiconductor device. The interconnect is disposed over the substrate and electrically coupled to the semiconductor device, and includes a metallization layer and a capping layer. The metallization layer is disposed over the substrate and includes a via portion and a lin...