US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,781, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Ting-Yu Yeh (Hsinchu, Taiwan), Ching-He Chen (Taoyuan, Taiwan), Kuo-Chiang Ting (Hsinchu, Taiwan), Weiming Chris Chen (Taipei, Taiwan), Chia-Hao Hsu (Hsinchu, Taiwan), Kuan-Yu Huang (Taipei, Taiwan) and Shu-Chia Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. A plurality of conductive balls is placed over a circuit substrate, where each of t...