US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Semiconductor package including stress-reduction structures and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,772, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including stress-reduction structures and methods of forming the same" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Yu-Sheng Lin (Zhubei, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Shin-Puu Jeng (Po-Shan Village, Taiwan) and Chin-Hua Wang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of package substrate surrounding t...