US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 10 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,903, issued on June 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing thereof" was invented by Shih-Yao Lin (New Taipei, Taiwan), Chieh-Ning Feng (Taichung, Taiwan), Hsiaowen Lee (Hsinchu, Taiwan) and Ming-Ching Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a plurality of first channel layers vertically spaced from one another and a plurality of second channel layers vertically spaced form one another. Each of the plurality of first and second channel layers extend along a first lateral direction. The semic...