US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 10 for "Semiconductor device with contact structures" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,765, issued on June 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device with contact structures" was invented by Yi-Hsiung Lin (Zhubei, Taiwan), Yi-Hsun Chiu (Zhubei, Taiwan) and Shang-Wen Chang (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device structure is provided. The semiconductor device structure includes a first epitaxial structure and a second epitaxial structure spaced apart from the first epitaxial structure. The semiconductor device structure also includes a conductive contact electrically connected to the first epitaxial structure and a first cond...