US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Probe card needle shape and method of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,326,463, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Probe card needle shape and method of manufacturing" was invented by Ting-Yu Chiu (Hsinchu, Taiwan), Yi-Neng Chang (Hsinchu, Taiwan), Wen-Chun Tu (Hsinchu, Taiwan), Te-Kun Lin (Hsinchu, Taiwan) and Chien Fang Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a method of manufacturing one or more needles of a probe card by refining and processing a conductive body that extends from the probe card to form a respective tip at the end of the respective conductive body. Forming the respective ti...