US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 10 for "Package structure and method of forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,825, issued on June 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure and method of forming thereof" was invented by Jen-Yuan Chang (Hsinchu, Taiwan) and Sheng-Chih Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a package substrate, a first die, a second die, a first underfill, and a second underfill. The first die and a second die are disposed on the package substrate. The first underfill is between the first die and the package substrate, and the first underfill includes a first extension portion extending from a first sidewall of the first d...