US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 10 for "Interconnect structures having varied materials" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,760, issued on June 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnect structures having varied materials" was invented by Guanyu Luo (Hsinchu, Taiwan), Shin-Yi Yang (New Taipei, Taiwan), Ming-Han Lee (Taipei, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first underlying metal line and a second underlying metal line in a first dielectric layer over a substrate. The semiconductor device includes a first metal feature and a second metal feature in a second dielectric layer over the first dielectric layer. The first metal fea...