US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Integrated circuit package and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,815, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method of forming the same" was invented by Der-Chyang Yeh (Hsinchu, Taiwan), Sung-Feng Yeh (Taipei, Taiwan) and Jian-Wei Hong (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching a first die and a second die to a first wafer, the first wafer comprising: a first carrier substrate; and a first interconnect structure comprising first dielectric layers and first conductive features embedded in the first dielectric layers; attaching a third die to the first die and a fourth die to t...