ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,819, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).
"Devices employing thermal and mechanical enhanced layers and methods of forming same" was invented by Chen-Hua Yu (Hsinchu, Taiwan), An-Jhih Su (Taoyuan, Taiwan), Wei-Yu Chen (New Taipei, Taiwan), Ying-Ju Chen (Tuku Township, Taiwan), Tsung-Shu Lin (New Taipei, Taiwan), Chin-Chuan Chang (Zhudong Township, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan), Wei-Cheng Wu (Hsinchu, Taiwan), Li-Hsien Huang (Zhubei, Taiwan), Chi-Hsi Wu (Hsinchu, Taiwan) and Der-Chyang Yeh (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attachi...