US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 10 for "Device for conditioning chemical mechanical polishing" (Taiwanese Inventor)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,106, issued on June 10, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Device for conditioning chemical mechanical polishing" was invented by Chun-Hsi Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conditioning device for conditioning a polishing pad used in chemical mechanical polishing includes a base having an opening and a conditioning disk removably attached to the base. The conditioning disk includes a conditioning portion disposed on a first surface of the base and a fitting portion removably fitted into or through the opening of the base. The fitting portion is fitted through or i...