US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Chemical mechanical polishing apparatus and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,102, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chemical mechanical polishing apparatus and method" was invented by Shich-Chang Suen (Hsinchu, Taiwan), Liang-Guang Chen (Hsinchu, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing platform of a polishing apparatus includes a platen, a polishing pad, and an electric field element disposed between the platen and the polishing pad. The polishing apparatus further includes a controller configured to apply voltages to the electric field element. A first voltage is applied to the electric field element ...