US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Architecture for computing system package" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,796, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Architecture for computing system package" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Chieh-Yen Chen (Taipei, Taiwan), Chuei-Tang Wang (Taichung, Taiwan) and Chung-Hao Tsai (Huatan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a reconstructed wafer, which includes forming a redistribution structure over a carrier, bonding a first plurality of memory dies over the redistribution structure, bonding a plurality of bridge dies over the redistribution structure, and bonding a plurality of logic dies over ...