US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 8 for "Semiconductor structure and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,658, issued on July 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of forming the same" was invented by Yi-Huan Chen (Hsinchu, Taiwan), Chien-Chih Chou (New Taipei, Taiwan), Szu-Hsien Liu (Hsinchu County, Taiwan), Kong-Beng Thei (Hsinchu County, Taiwan), Huan-Chih Yuan (Hsinchu County, Taiwan) and Jhu-Min Song (Nantou County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes: a substrate; a gate electrode disposed within the substrate; a gate diel...