US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Semiconductor packages and methods of manufacturing thereof" (California Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,006, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and methods of manufacturing thereof" was invented by Shenggao Li (Cupertino, Calif.) and Tze-Chiang Huang (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die comprising a voltage regulator that has a first input and a second input. The semiconductor package includes a second die coupled to the first die and comprising a first load circuit. The voltage regulator is configured to provide a regulated voltage to the first load circuit through a first through via structure ...