US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Semiconductor package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,001, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package structure and method for forming the same" was invented by Yen-Chu Tu (Kaohsiung, Taiwan), Shang-Lun Tsai (Hsinchu, Taiwan), Monsen Liu (Hsinchu County, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a connecting element, a first semiconductor device, a second semiconductor device, a first underfill layer, and a pa...