US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Semiconductor package and methods of manufacturing" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,938, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and methods of manufacturing" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package, which may correspond to a high-performance computing package, includes an interposer over a substrate. A spacer structure is mounted to a bottom surface of the interposer. The spacer structure is configured to maintain a clearance between a bottom surface of an integrated circuit die mounted to the bottom surfac...