US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Semiconductor memory devices and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,629, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor memory devices and methods of manufacturing thereof" was invented by Meng-Han Lin (New Taipei, Taiwan) and Chia-En Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die comprises a device portion comprising: an array of active memory devices extending in a first direction, and interface portions located adjacent to axial ends of the device portion in the first direction. The interface portions have a staircase profile in a vertical direction and comprise an array of dummy memory devices and an array ...