US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Semiconductor devices and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,958, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of formation" was invented by Shu-Cheng Chin (Hsinchu, Taiwan), Chih-Chien Chi (Hsinchu, Taiwan), Hsin-Ying Peng (Hsinchu, Taiwan), Jau-Jiun Huang (Kaohsiung, Taiwan), Ya-Lien Lee (Baoshan Township, Taiwan), Kuan-Chia Chen (Hsinchu, Taiwan), Chia-Pang Kuo (Taoyuan, Taiwan) and Yao-Min Liu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various back end of line (BEOL) layer formation techniques described herein enable reduced contact resistance, reduced surface roughness, and/or increased semiconductor...